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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA TM Order this document by MMBF2202PT1/D MMBF2202PT1 Low rDS(on) Small-Signal MOSFETs TMOS Single P-Channel Field Effect Transistors Part of the GreenLineTM Portfolio of devices with energy-conserving traits. These miniature surface mount MOSFETs utilize Motorola's High Cell Density, HDTMOS process. Low rDS(on) assures minimal power loss and conserves energy, making this device ideal for use in small power management circuitry. Typical applications are dc-dc converters, power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. * Low rDS(on) Provides Higher Efficiency and Extends Battery Life * Miniature SC-70/SOT-323 Surface Mount Package Saves Board Space Motorola Preferred Device TM 3 DRAIN P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET rDS(on) = 2.2 OHM 3 1 2 1 GATE CASE 419-02, STYLE 8 SC-70/SOT-323 2 SOURCE MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Drain-to-Source Voltage Gate-to-Source Voltage -- Continuous Drain Current -- Continuous @ TA = 25C Drain Current -- Continuous @ TA = 70C Drain Current -- Pulsed Drain Current (tp 10 s) Total Power Dissipation @ TA = 25C(1) Derate above 25C Operating and Storage Temperature Range Thermal Resistance -- Junction-to-Ambient Maximum Lead Temperature for Soldering Purposes, for 10 seconds Symbol VDSS VGS ID ID IDM PD TJ, Tstg RJA TL Value 20 20 300 240 750 150 1.2 - 55 to 150 833 260 Unit Vdc Vdc mAdc mW mW/C C C/W C DEVICE MARKING P3 (1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint. ORDERING INFORMATION Device MMBF2202PT1 MMBF2202PT3 Reel Size 7 13 Tape Width 8 mm embossed tape 8 mm embossed tape Quantity 3000 10,000 GreenLine is a trademark of Motorola, Inc. HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a registered trademark of the Berquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Motorola Inc. 1998 (c) Motorola, Small-Signal Transistors, FETs and Diodes Device Data 1 MMBF2202PT1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (VGS = 0 Vdc, ID = 10 A) Zero Gate Voltage Drain Current (VDS = 16 Vdc, VGS = 0 Vdc) (VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C) Gate-Body Leakage Current (VGS = 20 Vdc, VDS = 0) ON CHARACTERISTICS(1) Gate Threshold Voltage (VDS = VGS, ID = 250 Adc) Static Drain-to-Source On-Resistance (VGS = 10 Vdc, ID = 200 mAdc) (VGS = 4.5 Vdc, ID = 50 mAdc) Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance SWITCHING CHARACTERISTICS(2) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge (See Figure 5) (VDS = 16 V, VGS = 10 V, ID = 200 mA) (VDD = -15 Vdc, 15 Vd RL = 75 , ID = 200 mAdc, mAdc VGEN = -10 V, RG = 6.0 ) , ) td(on) tr td(off) tf QT -- -- -- -- -- 2.5 1.0 16 8.0 2700 -- -- -- -- -- pC ns (VDS = 5.0 V) (VDS = 5.0 V) (VDG = 5.0 V) Ciss Coss Crss -- -- -- 50 45 20 -- -- -- pF VGS(th) rDS(on) -- -- gFS -- 1.5 2.0 600 2.2 3.5 -- mMhos 1.0 1.7 2.4 Vdc Ohms V(BR)DSS IDSS -- -- IGSS -- -- -- -- 1.0 10 100 nAdc 20 -- -- Vdc Adc Symbol Min Typ Max Unit SOURCE-DRAIN DIODE CHARACTERISTICS Continuous Current Pulsed Current Forward Voltage(2) (1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%. (2) Switching characteristics are independent of operating junction temperature. IS ISM VSD -- -- -- -- -- 1.5 0.3 0.75 -- V A TYPICAL CHARACTERISTICS 10 rDS(on) , ON RESISTANCE (OHMS) rDS(on) , ON RESISTANCE (OHMS) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 - 40 - 20 0 20 40 60 80 100 120 140 160 VGS = 10 V ID = 200 mA VGS = 4.5 V ID = 50 mA 8 ID = 200 mA 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 VGS, GATE-SOURCE VOLTAGE (VOLTS) TEMPERATURE (C) Figure 1. On Resistance versus Gate-Source Voltage Figure 2. On Resistance versus Temperature 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBF2202PT1 6 rDS(on) , ON RESISTANCE (OHMS) 5 4 3 2 1 0 VGS = 10 V VGS = 4.5 V 1.0 0.9 I D, DRAIN CURRENT (AMPS) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 - 55 150 25 ID, DRAIN CURRENT (AMPS) VGS, GATE-SOURCE VOLTAGE (VOLTS) Figure 3. On Resistance versus Drain Current Figure 4. Transfer Characteristics 1 ID(on), DRAIN CURRENT (AMPS) IS , SOURCE CURRENT (AMPS) 0.8 0.7 0.6 0.5 0.4 0.3 VGS = 3.5 V 0.2 0.1 VGS = 3 V VGS = 4 V VGS = 5 V 25 0.1 150 VGS = 4.5 V 0.01 0.001 0 0.5 1.0 1.5 2.0 2.5 0 0 1 2 3 4 5 6 7 8 9 10 VSD, SOURCE-DRAIN FORWARD VOLTAGE (VOLTS) VDS, DRAIN-SOURCE VOLTAGE (VOLTS) Figure 5. Source-Drain Forward Voltage Figure 6. On Region Characteristics 50 45 40 C, CAPACITANCE (pF) 35 30 25 20 15 10 5 0 0 2 4 6 8 10 12 14 Coss Crss 16 18 20 VDS, DRAIN-SOURCE VOLTAGE (VOLTS) Ciss VGS = 0 V f = 1 MHz Figure 7. Capacitance Variation Motorola Small-Signal Transistors, FETs and Diodes Device Data 3 MMBF2202PT1 INFORMATION FOR USING THE SC-70/SOT-323 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.025 0.025 0.65 0.65 0.075 1.9 0.035 0.9 0.028 0.7 inches mm SC-70/SOT-323 SC-70/SOT-323 POWER DISSIPATION The power dissipation of the SC-70/SOT-323 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SC-70/SOT-323 package, PD can be calculated as follows: PD = TJ(max) - TA RJA calculate the power dissipation of the device which in this case is 150 milliwatts. PD = 150C - 25C 833C/W = 150 milliwatts The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can The 833C/W for the SC-70/SOT-323 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milliwatts. There are other alternatives to achieving higher power dissipation from the SC-70/SOT-323 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5C or less. 260C for more than 10 seconds. 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBF2202PT1 PACKAGE DIMENSIONS A L 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.035 0.049 0.012 0.016 0.047 0.055 0.000 0.004 0.004 0.010 0.017 REF 0.026 BSC 0.028 REF 0.031 0.039 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.90 1.25 0.30 0.40 1.20 1.40 0.00 0.10 0.10 0.25 0.425 REF 0.650 BSC 0.700 REF 0.80 1.00 2.00 2.20 0.30 0.40 S 1 2 B V G D C 0.05 (0.002) RN K J DIM A B C D G H J K L N R S V H STYLE 8: PIN 1. GATE 2. SOURCE 3. DRAIN CASE 419-02 SC-70/SOT-323 ISSUE J Motorola Small-Signal Transistors, FETs and Diodes Device Data 5 MMBF2202PT1 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. 81-3-5487-8488 MfaxTM: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, - US & Canada ONLY 1-800-774-1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 INTERNET: http://motorola.com/sps 6 MMBF2202PT1/D Motorola Small-Signal Transistors, FETs and Diodes Device Data |
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